Journal of Science  and Technology of Composites

Journal of Science and Technology of Composites

Preparation of toughened high temperature bismaleimide resin based on DGEBA epoxy resin and investigation of its composite properties with glass fibers

Document Type : Research Paper

Authors
Department of Polymer Engineering, Composite Research Institute, Malek Ashtar University of Technology, Tehran, Iran.
Abstract
In this study, a new bismaleimide resin was designed and synthesized based on epoxy resin to improve the mechanical and thermal properties of epoxy resin and to overcome the inherent brittleness of bismaleimide. For this aim, two maleimide precursors including 4-hydroxyphenyl maleimide (HPM) and 4-carboxyphenyl maleimide (CPM) were synthesized through the reaction of maleic anhydride with 4-aminophenol and 4-aminobenzoic acid, respectively, in the presence of suitable dehydrating agents. These intermediates were then reacted with diglycidyl ether bisphenol A (DGEBA) epoxy resin. Through DSC and FT-IR analyses, the curing cycle of synthesized bismaleimide resin was determined. TGA results indicated the higher thermal stability of the synthesized bismaleimide resin compared to neat epoxy resin. ILSS of the composites prepared by glass fibers showed 44.03 MPa and 46.40 MPa at 78 °C for bismaleimides synthesized from HPM and CPM, respectively. Moreover, the ILSS of the prepared composites at room temperatures were determined 50.10 MPa and 52.65 MPa, respectively, indicating an improvement in both interlaminar shear strength and toughness compared to neat epoxy resin.
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