نوع مقاله : مقاله پژوهشی

نویسندگان

1 دانشجوی ارشد، مهندسی مکانیک، دانشگاه علم و صنعت، تهران.

2 استادیار، مهندسی مکانیک، دانشگاه علم و صنعت، تهران.

10.22068/jstc.2022.551477.1780

چکیده

مواد خودترمیم به‌عنوان یکی از انواع مواد هوشمند در ترمیم و تعمیر وسایل و پیشگیری از خرابی و از کار افتادگی ابزارها، قابلیت استفاده دارند. روش‌های متعددی برای افزایش بازده و تکرار پذیر کردن فرایند خودترمیمی وجود دارد که یکی از آن روش‌ها، ترکیب میکروکپسول‌های خودترمیم با آلیاژهای حافظه‌دار است. هرچند تعدادی پژوهش آزمایشگاهی در این زمینه انجام شده امّا به این روش آن چنان که باید توجه نشده است. در این پژوهش تلاش شده است تا با استفاده از روش شبیه‌سازی اجزای محدود، نحوه عملکرد این ترکیب ارزیابی شود. به این منظور از میکروکپسولی شیشه‌ای در زمینه بتن و آلیاژ حافظه‌دار از جنس نیکل-تیتانیوم استفاده شده است. پس از بررسی نتایج تأثیر سیم‌های آلیاژ حافظه دار بر افزایش حداکثر تنش شکست، کاملاً مشهود بود. با افزودن دو سیم حافظه دار تنش شکست از 1.93 مگاپاسکال به 2.08 مگاپاسکال رسیده است. همچنین اثر مهم‌تر، بستن دهانه‌ی ترک می‌باشد به نحوی که با استفاده از دو سیم حافظه دار، بازشدگی دهانه‌ی ترک از 5 میکرومتر به 0.008 میکرومتر رسیده است. سپس تأثیر شعاع سیم‌های آلیاژ حافظه‌دار و نسبت ضخامت و نسبت حجمی میکروکپسول بر تنش نهایی شکست و عملکرد خودترمیمی بررسی گردیده است. در انتها تأثیر استحکام لایه میانی بر شکست میکروکپسول و تنش نهایی شکست ارزیابی شده است.

کلیدواژه‌ها

عنوان مقاله [English]

A numerical study on crack closure using a combination of self-healing microcapsules and shape memory alloy wires

نویسندگان [English]

  • Mohsen Taheri Boroujeni 1
  • Mohammad Javad Ashrafi 2

1 School of Mechanical Engineering, Iran University of Science and Technology, Tehran, Iran.

2 School of Mechanical Engineering, Iran University of Science and Technology, Tehran, Iran.

چکیده [English]

Self-healing materials can be used as one of the types of smart materials in recovering and repairing equipment and preventing breakdown and fracture of tools. There are several ways to increase the efficiency and repeatability of the self-healing process, one of which is to combine self-healing microcapsules with shape memory alloys. Although several laboratory studies have been performed in this field, this method has not been given the attention it deserves. In this study, an attempt has been made to evaluate the performance of this compound using the finite element simulation method. For this purpose, used glass microcapsule and Ni-Ti SMA within the concrete matrix. After examining the results, the effect of shape memory alloy wires on increasing the maximum fracture stress was quite obvious. By adding two shape memory wires, the fracture tension has increased from 1.93 MPa to 2.08 MPa. Also, the most important effect is to close the crack opening distance in such a way that using two shape memory wires, the distance of the crack opening has decreased from 5 μm to 0.008 μm. Then, the effect of radius of memory alloy wires and thickness ratio and volume fraction of microcapsules on ultimate fracture stress and self-healing performance was investigated. Finally, the effect of interface strength on microcapsule fracture and ultimate fracture stress is evaluated.

کلیدواژه‌ها [English]

  • Shape memory alloy
  • crack
  • microcapsule
  • self-healing
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